Module

ABSTRACT

A module includes: a substrate having a first surface; a first component mounted on the first surface; a resin film that covers the first component along a shape of the first component, and also covers a part of the first surface; a conductor film that covers at least a part of the resin film along the shape of the first component, and covers at least a part of a portion in which the resin film covers the part of the first surface; and a conductor structure disposed to extend over a part of the resin film. The conductor structure includes a first end portion, a second end portion, and an intermediate portion. The first end portion and the second end portion are connected to the first surface. The intermediate portion is in contact with the conductor film.

CROSS REFERENCE TO RELATED APPLICATION

This is a continuation of International Application No.PCT/JP2021/021339 filed on Jun. 4, 2021 which claims priority fromJapanese Patent Application No.

2020-103943 filed on Jun. 16, 2020. The contents of these applicationsare incorporated herein by reference in their entireties.

BACKGROUND OF THE DISCLOSURE Field of the Disclosure

The present disclosure relates to a module.

Description of the Related Art

Japanese Patent Laying-Open No. 2002-334954 (PTL 1) discloses aconfiguration of an electronic device. The electronic device includes anelectronic component mounted on a surface of a mounting substrate, aresin film that covers the electronic component and the mountingsubstrate and is bonded to the mounting substrate, and a conductive filmthat covers the resin film. The resin film is in close contact withsurfaces of the electronic component and the mounting substrate.

The mounting substrate is provided with a grounding conductor portion.The resin film is provided with a hole at a position corresponding tothe grounding conductor portion. The conductive film is electricallyconnected to the grounding conductor portion through the hole.

-   PTL 1: Japanese Patent Laid-Open No. 2002-334954

BRIEF SUMMARY OF THE DISCLOSURE

In the configuration described in PTL 1, the conductive film that coversthe resin film is connected to the grounding conductor portion throughthe hole provided in the resin film. This hole is formed with a cutterhaving a shape such as a conical shape, a pyramid shape, and a wedgeshape, and the conductive film is formed by sputtering to be depositedon a surface of the resin film and inside the hole. When the conductivefilm is formed in this manner, the conductive film may fail to be formedto reach the grounding conductor portion through the hole. Therefore,electrical connection of the conductive film to the grounding conductorportion has been uncertain.

Accordingly, a possible benefit of the present disclosure is to providea module which adopts a structure of covering a component mounted on asubstrate with a two-layer structure including a resin film and aconductive film, in a close contact manner, and in which the conductivefilm is reliably electrically connected to an electrode provided on thesubstrate.

In order to achieve the possible benefit described above, a module basedon the present disclosure includes: a substrate having a first surface;a first component mounted on the first surface; a resin film that coversthe first component along a shape of the first component, and alsocovers a part of the first surface; a first conductor film that coversat least a part of the resin film along the shape of the firstcomponent, and covers at least a part of a portion in which the resinfilm covers the part of the first surface; and a conductor structuredisposed to extend over a part of the resin film at a location where thefirst conductor film covers the first surface with the resin film beinginterposed therebetween. The conductor structure includes a first endportion, a second end portion, and an intermediate portion connectingthe first end portion and the second end portion. The first end portionis connected to the first surface. The second end portion is alsoconnected to the first surface. The intermediate portion is in contactwith the first conductor film.

According to the present disclosure, it is possible to provide a modulewhich adopts a structure of covering a component mounted on a substratewith a two-layer structure including a resin film and a conductive film,in a close contact manner, and in which the conductive film is reliablyelectrically connected to an electrode provided on the substrate.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a plan view of a module in a first embodiment based on thepresent disclosure.

FIG. 2 is a cross sectional view taken along a line II-II in FIG. 1 andviewed in the direction of arrows.

FIG. 3 is an enlarged cross sectional view of a conductor structure andits vicinity included in the module in the first embodiment based on thepresent disclosure.

FIG. 4 is an explanatory view of a first step of a method formanufacturing the module in the first embodiment based on the presentdisclosure.

FIG. 5 is an explanatory view of a second step of the method formanufacturing the module in the first embodiment based on the presentdisclosure.

FIG. 6 is an explanatory view of a third step of the method formanufacturing the module in the first embodiment based on the presentdisclosure.

FIG. 7 is an explanatory view of a fourth step of the method formanufacturing the module in the first embodiment based on the presentdisclosure.

FIG. 8 is an enlarged partial cross sectional view of a module in asecond embodiment based on the present disclosure.

FIG. 9 is an explanatory view of a first step of a method formanufacturing the module in the second embodiment based on the presentdisclosure.

FIG. 10 is an explanatory view of a second step of the method formanufacturing the module in the second embodiment based on the presentdisclosure.

FIG. 11 is a front view of a conductor structure included in the modulein the second embodiment based on the present disclosure.

FIG. 12 is an explanatory view of a third step of the method formanufacturing the module in the second embodiment based on the presentdisclosure.

FIG. 13 is an enlarged partial cross sectional view of a variation ofthe module in the second embodiment based on the present disclosure.

FIG. 14 is a first perspective view of a module in a third embodimentbased on the present disclosure.

FIG. 15 is a second perspective view of the module in the thirdembodiment based on the present disclosure.

FIG. 16 is a perspective plan view of the module in the third embodimentbased on the present disclosure.

FIG. 17 is a cross sectional view taken along a line XVII-XVII in FIG.16 and viewed in the direction of arrows.

FIG. 18 is a first perspective view of a module in a fourth embodimentbased on the present disclosure.

FIG. 19 is a second perspective view of the module in the fourthembodiment based on the present disclosure.

FIG. 20 is a perspective bottom view of the module in the fourthembodiment based on the present disclosure.

FIG. 21 is a cross sectional view taken along a line XXI-XXI in FIG. 20and viewed in the direction of arrows.

FIG. 22 is a plan view of a module in a fifth embodiment based on thepresent disclosure.

FIG. 23 is a cross sectional view taken along a line XXIII-XXIII in FIG.22 and viewed in the direction of arrows.

FIG. 24 is an enlarged cross sectional view of a conductor structure andits vicinity included in the module in the fifth embodiment based on thepresent disclosure.

FIG. 25 is a plan view of a module in a sixth embodiment based on thepresent disclosure.

FIG. 26 is a cross sectional view taken along a line XXVI-XXVI in FIG.25 and viewed in the direction of arrows.

FIG. 27 is an enlarged cross sectional view of a conductor structure andits vicinity included in the module in the sixth embodiment based on thepresent disclosure.

FIG. 28 is a first perspective view of a module in a seventh embodimentbased on the present disclosure.

FIG. 29 is a second perspective view of the module in the seventhembodiment based on the present disclosure.

FIG. 30 is a perspective plan view of the module in the seventhembodiment based on the present disclosure.

FIG. 31 is a cross sectional view taken along a line XXXI-XXXI in FIG.30 and viewed in the direction of arrows.

FIG. 32 is a cross sectional view of a variation of the module in theseventh embodiment based on the present disclosure.

DETAILED DESCRIPTION OF THE DISCLOSURE

The dimensional ratios shown in the drawings do not necessarilyrepresent actual dimensional ratios faithfully, and may be exaggeratedfor convenience of explanation. In the description below, mentioning theconcept of “upper” or “lower” does not necessarily indicate an absoluteupper or lower position, but may indicate a relatively upper or lowerposition in a posture shown.

First Embodiment

Referring to FIGS. 1 to 3 , a module in a first embodiment based on thepresent disclosure will be described. FIG. 1 shows a plan view of themodule in the present embodiment. FIG. 2 shows a cross sectional viewtaken along a line II-II in FIG. 1 and viewed in the direction ofarrows. A module 101 in the present embodiment is an antenna module.

Module 101 in the present embodiment includes a substrate 1 having afirst surface 1 a, a first component 41 mounted on first surface 1 a, aresin film 21, a first conductor film 5 a, and a conductor structure 3.Resin film 21 covers first component 41 along a shape of first component41, and also covers a part of first surface 1 a. First conductor film 5a covers at least a part of resin film 21 along the shape of firstcomponent 41, and covers at least a part of a portion in which resinfilm 21 covers the part of first surface 1 a. Conductor structure 3 isdisposed to extend over a part of resin film 21 at a location wherefirst conductor film 5 a covers first surface 1 a with resin film 21being interposed therebetween.

FIG. 3 shows an enlarged view of conductor structure 3 and its vicinity.It is to be noted that FIG. 3 shows an enlarged view of a cross sectiontaken in a direction 90° different from that for the cross section shownin FIG. 2 . That is, the right-left direction in FIG. 3 corresponds tothe front-back direction in the paper plane in FIG. 2 . Here, an examplewhere conductor structure 3 is a wire is shown. The wire is arranged bywire bonding to connect two ground electrodes 15 provided on firstsurface 1 a of substrate 1. Conductor structure 3 includes a first endportion 31, a second end portion 32, and an intermediate portion 33connecting first end portion 31 and second end portion 32. First endportion 31 is connected to first surface 1 a. Second end portion 32 isalso connected to first surface 1 a. The expression “being connected tofirst surface 1 a” used herein has a meaning including being connectedto an electrode provided on first surface 1 a. Specifically, first endportion 31 and second end portion 32 are respectively connected toseparate ground electrodes 15. Intermediate portion 33 is in contactwith first conductor film 5 a. Intermediate portion 33 and firstconductor film 5 a in contact with each other are in a state where theyare electrically connected. Intermediate portion 33 is disposed toextend over first conductor film 5 a. That is, intermediate portion 33passes on a side farther than first conductor film 5 a, when viewed fromfirst surface 1 a.

Substrate 1 has a second surface 1 b as a surface opposite to firstsurface 1 a. Substrate 1 illustrated herein is a multilayer substrate asshown in FIG. 2 . Substrate 1 includes a plurality of insulating layers2. A patch antenna 52 is disposed inside substrate 1, at a positionclose to second surface 1 b. A ground conductor pattern 51 is disposedinside substrate 1, at a position closer to first surface 1 a than patchantenna 52.

In addition to first component 41, components 42, 43, and 44 are alsomounted on first surface 1 a. First surface 1 a is provided with severalpad electrodes 14, and first component 41 and components 42, 43, and 44are respectively mounted via pad electrodes 14. First component 41 maybe an IC (Integrated Circuit), for example. First component 41 may be anLNA (Low Noise Amplifier), for example. A connector 50 is also mountedon first surface 1 a. Connector 50 is not covered with resin film 21.Component 44 is covered with first conductor film 5 a with resin film 21being interposed therebetween, as with first component 41.

Components 42 and 43 are also covered with resin film 21. A secondconductor film 5 b is provided to cover components 42 and 43 with resinfilm 21 being interposed therebetween. First conductor film 5 a andsecond conductor film 5 b may be made of the same material, and may beformed at the same time by the same step. First conductor film 5 a andsecond conductor film 5 b are spaced from each other. Therefore, firstconductor film 5 a and second conductor film 5 b are electricallyindependent of each other. The wire as conductor structure 3 is alsoprovided between component 42 and component 43.

According to the present embodiment, since there exists first conductorfilm 5 a that covers first component 41 along the shape of firstcomponent 41 with resin film 21 being interposed therebetween, firstconductor film 5 a can act as a shield film at a position extremelyclose to first component 41. Further, since intermediate portion 33 ofconductor structure 3 in a shape in which both the end portions areconnected to first surface 1 a is in contact with first conductor film 5a, connection for grounding first conductor film 5 a can be ensured viaconductor structure 3.

Therefore, according to the present embodiment, it is possible toprovide a module which adopts a structure of covering a componentmounted on a substrate with a two-layer structure including a resin filmand a conductive film, in a close contact manner, and in which theconductive film is reliably electrically connected to an electrodeprovided on the substrate.

Further, in the present embodiment, since conductor structure 3 isdisposed to extend over a part of resin film 21, it is possible to makepeeling of resin film 21 less likely to occur.

In the present embodiment, since first conductor film 5 a that can actas a shield film for first component 41 exists at the position extremelyclose to first component 41, the occupied volume of module 101 as awhole can be suppressed to be small.

As shown in the present embodiment, conductor structure 3 is preferablya wire. By adopting this configuration, conductor structure 3 can beeasily implemented.

As shown in the present embodiment, the module preferably includes anantenna. By including an antenna, the module can exchange a signal as anantenna module. As shown in the present embodiment, preferably,substrate 1 has second surface 1 b as a surface opposite to firstsurface 1 a, and the antenna is disposed inside substrate 1 along secondsurface 1 b.

In the present embodiment, since the wire as conductor structure 3 isalso provided between component 42 and component 43, noise interferencebetween these components 42 and 43 can be suppressed.

(Manufacturing Method)

Referring to FIGS. 4 to 7 , a manufacturing method for obtaining module101 in the present embodiment will be described. Here, the descriptionwill be continued with only a partial range being shown, for convenienceof explanation.

First, as shown in FIG. 4 , substrate 1 having first surface 1 a isprepared. First surface 1 a of substrate 1 is provided with groundelectrodes 15. Ground electrodes 15 can be formed, for example, byforming a conductor film to cover entire first surface 1 a, and thenpatterning the conductor film.

On the other hand, as shown in FIG. 5 , resin film 21 is prepared. Atthis point of time, resin film 21 is a sheet-like film. One surface ofresin film 21 is covered with first conductor film 5 a. Openings 25 areprovided to penetrate resin film 21 and first conductor film 5 acollectively. Openings 25 can be formed, for example, by laserprocessing. Alternatively, the openings may be formed by removingdesired regions of first conductor film 5 a by etching, and thereafterperforming laser processing on resin film 21.

Resin film 21 shown in FIG. 5 is affixed to substrate 1 shown in FIG. 4. Actually, sheet-like resin film 21 is placed over first component 41,and is heated and pressurized, and thereby resin film 21 is deformed.Resin film 21 sticks to first component 41 to come into close contactwith first component 41, and at the same time also comes into closecontact with first surface 1 a. Thus, in a partial region, resin film 21is in close contact with substrate 1, as shown in FIG. 6 .

As shown in FIG. 7 , wire bonding is performed. A wire is supplied froma head 26 of a wire bonder. The central part of FIG. 7 shows a statewhere the first bonding has been already performed. That is, an endportion of the wire is already connected to one ground electrode 15.Head 26 is moving toward another ground electrode 15, while drawing thewire. Thereafter, the second bonding is performed and the wire isdetached from head 26, and thereby the structure shown in FIG. 3 isobtained. That is, conductor structure 3 is disposed to connect betweentwo ground electrodes 15 provided on first surface 1 a of substrate 1.Intermediate portion 33 of conductor structure 3 is in contact withfirst conductor film 5 a. Thereby, conductor structure 3 and firstconductor film 5 a are electrically connected. The contents of thedescription provided for first conductor film 5 a also apply to secondconductor film 5 b.

Although the first embodiment has been described based on an examplewhere conductor structure 3 is a wire, the conductor structure is notlimited to a wire.

Second Embodiment

Referring to FIG. 8 , a module in a second embodiment based on thepresent disclosure will be described. Although this module has the samebasic configuration as that of module 101 described in the firstembodiment, it has a different conductor structure. Thus, FIG. 8 showsan enlarged view of a conductor structure and its vicinity of the modulein the present embodiment. In the present embodiment, a conductorstructure 3 i as shown in FIG. 8 is used instead of conductor structure3 shown in FIG. 3 . Conductor structure 3 i is a metal pin having ashape in which it is bent substantially at a right angle at twointermediate positions. Conductor structure 3 i has this shape before itis connected to first surface 1 a of substrate 1. Solder 18 is placed onground electrodes 15 provided on first surface 1 a. Solder 18 may beobtained by solidifying solder paste. First end portion 31 and secondend portion 32 of conductor structure 3 i are respectively connectedwith ground electrodes 15 via solder 18.

Also in the present embodiment, the effect as described in the firstembodiment can be achieved. Since conductor structure 3 i, which is ametal pin, has a more stable shape when compared with conductorstructure 3, which is a wire, it can be expected to be easily disposedeven in a narrow region. Openings 25 for connecting conductor structure3 i to ground electrodes 15 may have a smaller size, which can savespace.

As shown in the present embodiment, conductor structure 3 is preferablya metal pin.

(Manufacturing Method)

Referring to FIGS. 9 to 12 , a manufacturing method for obtaining themodule in the present embodiment will be described. Here, thedescription will be continued with only a partial range being shown, forconvenience of explanation.

First, as shown in FIG. 9 , substrate 1 having first surface 1 a isprepared. First surface 1 a of substrate 1 is provided with groundelectrodes 15, and solder paste 18 e is applied to ground electrodes 15.Resin film 21 as shown in FIG. 5 is prepared separately.

Resin film 21 shown in FIG. 5 is affixed to substrate 1 shown in FIG. 9. Actually, sheet-like resin film 21 is placed over first component 41,and is heated and pressurized, and thereby resin film 21 is deformed.Resin film 21 sticks to first component 41 to come into close contactwith first component 41, and at the same time also comes into closecontact with first surface 1 a. Thus, in a partial region, resin film 21is in close contact with substrate 1, as shown in FIG. 10 .

Conductor structure 3 i as shown in FIG. 11 is prepared. Conductorstructure 3 i may be a metal pin processed beforehand into a shape asshown herein. Conductor structure 3 i is connected to substrate 1. Firstend portion 31 and second end portion 32 of conductor structure 3 i passthrough openings 25 and come into contact with solder paste 18 e placedon ground electrodes 15. By performing reflow, solder paste 18 eelectrically connects conductor structure 3 i and ground electrodes 15,as solder 18, as shown in FIG. 12 .

Although an example in which openings 25 are provided in resin film 21as shown in FIG. 10 is shown herein, when conductor structure 3 i, whichis a metal pin, is used, gaps do not have to be provided around firstend portion 31 and second end portion 32 of conductor structure 3 i.FIG. 13 shows an example in this case. When conductor structure 3 i hasa certain degree of rigidity, it is also possible to cause conductorstructure 3 i to penetrate resin film 21 by pressing conductor structure3 i into resin film 21. In the example shown in FIG. 13 , there is nogap around first end portion 31 and second end portion 32, and resinfilm 21 is in contact with conductor structure 3 i.

Third Embodiment

Referring to FIGS. 14 to 17 , a module in a third embodiment based onthe present disclosure will be described. FIG. 14 shows an externalappearance of a module 102 in the present embodiment. An upper surfaceand side surfaces of module 102 are covered with a shield film 8. FIG.15 shows module 102 viewed obliquely from below in FIG. 14 . A lowersurface of module 102 is not covered with shield film 8, and substrate 1is exposed. A lower surface of substrate 1 is provided with one or moreexternal electrodes 11. The number, the size, and the arrangement ofexternal electrodes 11 shown in FIG. 15 are merely by way of example.FIG. 16 shows a perspective plan view of module 102. FIG. 16 correspondsto a top view of module 102 from which an upper surface of shield film 8has been removed and a first sealing resin 6 a has also been removed.FIG. 17 shows a cross sectional view taken along a line XVII-XVII inFIG. 16 and viewed in the direction of arrows. FIG. 17 also shows firstsealing resin 6 a and the like as they are present.

Module 102 includes substrate 1. Substrate 1 has first surface 1 a andsecond surface 1 b. Substrate 1 may include wiring on a surface thereofor inside thereof. Substrate 1 may be a resin substrate, or may be aceramic substrate. Substrate 1 may be a multilayer substrate. That is,substrate 1 may be a resin multilayer substrate, or may be a ceramicmultilayer substrate.

Substrate 1 has second surface 1 b as a surface opposite to firstsurface 1 a. Substrate 1 illustrated herein is a multilayer substrate.Substrate 1 includes the plurality of insulating layers 2. The pluralityof external electrodes 11 are disposed on second surface 1 b ofsubstrate 1. A conductor pattern 12 and conductor vias 13 are disposedas appropriate inside substrate 1. Pad electrodes 14 are disposed infirst surface 1 a of substrate 1. In addition to first component 41, forexample, components 42, 48, and 49 are also mounted on first surface 1a. These components are mounted via pad electrodes 14 in first surface 1a.

Resin film 21 is disposed to collectively cover first component 41 andthe several other components. Resin film 21 covers first component 41along the shape of first component 41. A first conductor film 5 isdisposed to cover resin film 21. First conductor film 5 covers at leasta part of resin film 21 along the shape of first component 41, andcovers at least a part of a portion in which resin film 21 covers thepart of first surface 1 a. Conductor structure 3 is disposed to extendover a part of resin film 21 at a location where first conductor film 5covers first surface 1 a with resin film 21 being interposedtherebetween. The configuration of conductor structure 3 and itsvicinity is the same as that described in the first embodiment. Insteadof conductor structure 3, conductor structure 3 i described in thesecond embodiment may be adopted. In the present embodiment, component42 is neither covered with resin film 21 nor with first conductor film5.

As shown in FIG. 17 , first sealing resin 6 a is disposed to cover firstsurface 1 a, first conductor film 5, and resin film 21. Component 42 isalso covered with first sealing resin 6 a. A portion of conductorstructure 3 exposed from first conductor film 5 and resin film 21 isalso covered with first sealing resin 6 a. First sealing resin 6 a maybe formed by molding. First sealing resin 6 a may be obtained by beingwidely formed on a collective substrate, which corresponds to substrates1 before being divided, and thereafter being divided into pieces havingan individual product size, together with substrates 1. Shield film 8 isdisposed to cover an upper surface and side surfaces of first sealingresin 6 a. Shield film 8 further covers side surfaces of substrate 1.Shield film 8 is a conductive film. Shield film 8 may be formed bysputtering, for example. Shield film 8 may be formed by stacking aplurality of metal films.

In the present embodiment, shielding performance surrounding firstcomponent 41 can be enhanced, for the reason as described in the firstembodiment. First component 41 is doubly shielded by both firstconductor film 5 and shield film 8. Electromagnetic influence betweenfirst component 41 and component 42 is shielded by first conductor film5. In the example shown in FIG. 17 , the upper surface of firstcomponent 41 is located at a position lower than the upper surface ofcomponent 42. When there is a difference in height between components inthis manner, if it is attempted to perform shielding using shield film 8only, concerning first component 41, shield film 8 is located at aposition distant from first component 41. However, in the presentembodiment, the first shielding can be provided by first conductor film5 at a position extremely close to first component 41, and thusshielding performance can be enhanced.

Fourth Embodiment

Referring to FIGS. 18 to 21 , a module in a fourth embodiment based onthe present disclosure will be described. FIG. 18 shows an externalappearance of a module 103 in the present embodiment. An upper surfaceand side surfaces of module 103 are covered with shield film 8. FIG. 19shows module 103 viewed obliquely from below in FIG. 18 . A lowersurface of module 103 is not covered with shield film 8, and firstsealing resin 6 a is exposed. One or more external electrodes 17 areexposed in a lower surface of first sealing resin 6 a.

FIG. 20 shows a perspective bottom view of module 103. That is, FIG. 20shows module 103 viewed from below, with first sealing resin 6 a exposedin the lower surface of module 103 being removed. FIG. 21 shows a crosssectional view taken along a line XXI-XXI in FIG. 20 and viewed in thedirection of arrows. FIG. 21 also shows first sealing resin 6 a and thelike as they are present. Module 103 includes a double-sided mountingstructure.

In the present embodiment, substrate 1 has second surface 1 b as asurface opposite to first surface 1 a, and component 43 is mounted onsecond surface 1 b as a second component. As shown in FIG. 21 , inmodule 103, a lower surface of substrate 1 is first surface 1 a, and anupper surface thereof is second surface 1 b. The expression “secondcomponent” used herein means a component mounted on a surface oppositeto the first component. A second sealing resin 6 b is disposed to coversecond surface 1 b and component 43 as the second component.

Also in the present embodiment, shielding performance of the module canbe enhanced. Since the double-sided mounting structure is adopted in thepresent embodiment, more components can be mounted on substrate 1.

In the example shown herein, of the both surfaces of substrate 1, firstsurface 1 a is located closer to a mother substrate or the like whenmodule 103 is mounted on the mother substrate. However, first surface 1a may be located farther from the mother substrate or the like whenmodule 103 is mounted on the mother substrate. In either case, firstcomponent 41 is mounted on first surface 1 a, resin film 21 and firstconductor film 5 cover first component 41, and conductor structure 3 isarranged on first surface 1 a.

Fifth Embodiment

Referring to FIGS. 22 to 24 , a module in a fifth embodiment based onthe present disclosure will be described. FIG. 22 shows a plan view ofthe module in the present embodiment. FIG. 23 is a cross sectional viewtaken along a line XXIII-XXIII in FIG. 22 and viewed in the direction ofarrows. A module 104 in the present embodiment is an antenna module.

Module 104 in the present embodiment includes substrate 1 having firstsurface 1 a, first component 41 mounted on first surface 1 a, resin film21, first conductor film 5 a, and conductor structure 3 i. Resin film 21covers first component 41 along the shape of first component 41, andalso covers a part of first surface 1 a. First conductor film 5 a coversat least a part of resin film 21 along the shape of first component 41,and covers at least a part of a portion in which resin film 21 coversthe part of first surface 1 a. Conductor structure 3 i is disposed toextend over a part of resin film 21 at a location where first conductorfilm 5 a covers first surface 1 a with resin film 21 being interposedtherebetween.

FIG. 24 shows an enlarged view of conductor structure 3 i and itsvicinity. Conductor structure 3 i is arranged to connect two groundelectrodes 15 provided on first surface 1 a of substrate 1. Conductorstructure 3 i includes first end portion 31, second end portion 32, andintermediate portion 33 connecting first end portion 31 and second endportion 32. First end portion 31 is connected to first surface 1 a.Second end portion 32 is also connected to first surface 1 a.Intermediate portion 33 is in contact with first conductor film 5 a.

First conductor film 5 a covers intermediate portion 33. That is,intermediate portion 33 passes on a side closer than first conductorfilm 5 a, when viewed from first surface 1 a. Although first conductorfilm 5 a located above intermediate portion 33 of conductor structure 3i and first conductor film 5 a located in a region with no conductorstructure 3 i appear to be separated and spaced in FIG. 24 , they merelyappear so in this cross section. Considering the spread in thefront-back direction in the paper plane in FIG. 24 , first conductorfilms 5 a which appear to be separated in FIG. 24 are all connected andelectrically integral. Both ends of conductor structure 3 i areconnected to ground electrodes 15 via solder 18.

The structure in the present embodiment can be obtained by arrangingconductor structure 3 i in a state where first conductor film 5 a hasnot been formed yet, then covering, with a mask or the like, a region inwhich first conductor film 5 a should not be formed, and thereafterperforming sputtering or the like. When sputtering is performed in suchan order, first conductor film 5 a is formed to cover intermediateportion 33 of conductor structure 3 i.

The contents of the description provided for first conductor film 5 aalso apply to second conductor film 5 b.

Also in the present embodiment, the same effect as that in the firstembodiment can be achieved. Further, in the present embodiment, sincefirst conductor film 5 a covers intermediate portion 33 of conductorstructure 3 i, electrical connection between conductor structure 3 i andfirst conductor film 5 a can be ensured. Furthermore, it may be possibleto make falling off of conductor structure 3 i less likely to occur.

Sixth Embodiment

Referring to FIGS. 25 to 27 , a module in a sixth embodiment based onthe present disclosure will be described. FIG. 25 shows a plan view ofthe module in the present embodiment. FIG. 26 is a cross sectional viewtaken along a line XXVI-XXVI in FIG. 25 and viewed in the direction ofarrows. A module 105 in the present embodiment is an antenna module.

In module 105, resin film 21 is disposed to collectively cover severalcomponents mounted on first surface 1 a of substrate 1. Module 105includes a first conductor film 5 c and a second conductor film 5 d.First conductor film 5 c and second conductor film 5 d are disposed topartially cover an upper surface of resin film 21. In the example shownherein, first conductor film 5 c is disposed to cover first component 41and component 44. Second conductor film 5 d is disposed to covercomponents 42 and 43. First conductor film 5 c and second conductor film5 d may be made of the same material, and may be formed at the same timeby the same step. First conductor film 5 c and second conductor film 5 dare spaced from each other. Therefore, first conductor film 5 c andsecond conductor film 5 d are electrically independent of each other.

Module 105 includes conductor structure 3. First conductor film 5 cincludes a plurality of linear portions 5 r disposed to be parallel toeach other with being spaced from each other, and conductor structure 3is disposed to extend over at least one of linear portions 5 r in awidth direction.

FIG. 27 shows an enlarged view of conductor structure 3 and itsvicinity. Here, an example where conductor structure 3 is a wire isshown. First surface 1 a of substrate 1 is provided with a groundelectrode 15 e in a longitudinal shape. The wire as conductor structure3 is arranged by wire bonding to connect two points on ground electrode15 e. Conductor structure 3 includes first end portion 31, second endportion 32, and intermediate portion 33 connecting first end portion 31and second end portion 32. First end portion 31 is connected to firstsurface 1 a. Second end portion 32 is also connected to first surface 1a. Intermediate portion 33 is in contact with first conductor film 5 a.Intermediate portion 33 is disposed to extend over first conductor film5 c. Intermediate portion 33 passes on a side farther than firstconductor film 5 c, when viewed from first surface 1 a. In a region ofthe upper surface of resin film 21 corresponding to between linearportions 5 r, the upper surface of resin film 21 is not covered withfirst conductor film 5 c.

Other than that, the configuration is the same as that of module 101described in the first embodiment.

Also in the present embodiment, the effect as described in the firstembodiment can be achieved. Further, in the present embodiment, sincethe portion in which first conductor film 5 c covers first component 41has a stripe shape as shown in FIG. 25 , it is possible to avoidoccurrence of an eddy current due to electromagnetic waves produced whenfirst component 41 is operated.

Seventh Embodiment

Referring to FIGS. 28 to 31 , a module in a seventh embodiment based onthe present disclosure will be described. FIG. 28 shows an externalappearance of a module 106 in the present embodiment. An upper surfaceand side surfaces of module 106 are covered with shield film 8. FIG. 29shows module 106 viewed obliquely from below in FIG. 28 . A lowersurface of module 106 is not covered with shield film 8, and substrate 1is exposed. The lower surface of substrate 1 is provided with one ormore external electrodes 11. The number, the size, and the arrangementof external electrodes 11 shown in FIG. 29 are merely by way of example.FIG. 30 shows a perspective plan view of module 106. FIG. 30 correspondsto a top view of module 106 from which the upper surface of shield film8 has been removed and first sealing resin 6 a has also been removed.FIG. 31 shows a cross sectional view taken along a line XXXI-XXXI inFIG. 30 and viewed in the direction of arrows. FIG. 31 also shows firstsealing resin 6 a and the like as they are present.

The basic configuration of module 106 is the same as the configurationof module 102 described in the third embodiment. Module 106 includesfirst conductor film 5 c instead of first conductor film 5. Firstconductor film 5 c includes the plurality of linear portions 5 rdisposed to be parallel to each other with being spaced from each other,as with those described in the sixth embodiment. Conductor structure 3is disposed to extend over at least one of linear portions 5 r in thewidth direction. In the present embodiment, first conductor film 5 c hasa stripe shape.

In the present embodiment, as shown in FIG. 31 , first sealing resin 6 ais disposed to cover first surface 1 a, first conductor film 5 c, andresin film 21. Component 42 is also covered with first sealing resin 6a. Shield film 8 is disposed to cover the upper surface and the sidesurfaces of first sealing resin 6 a. The details of first sealing resin6 a and shield film 8 are the same as those described in the thirdembodiment.

Since resin film 21 is exposed in the region between linear portions 5r, resin film 21 is directly covered with first sealing resin 6 a inthis region.

Also in the present embodiment, the effect as described in the sixthembodiment can be achieved. In the present embodiment, at least firstcomponent 41 is doubly surrounded by first conductor film 5 c and shieldfilm 8. Therefore, shielding performance for first component 41 can beenhanced. Although component 42 is not covered with first conductor film5 c in the present embodiment, it is surrounded by shield film 8, andthus a certain degree of shielding performance can be exhibited also forcomponent 42. Hence, reliability of module 106 as a whole can beenhanced.

It should be noted that a configuration such as a module 107 shown inFIG. 32 is also conceivable as a variation. Although module 107 has abasic configuration in common with that of module 106, module 107 is notprovided with first sealing resin 6 a and shield film 8. Instead, inmodule 107, component 42 is covered with a resin film 22. Resin film 22is spaced from resin film 21. Resin film 22 is formed separately fromresin film 21. Resin film 22 may be made of the same type of material asthat for resin film 21.

In module 107, a certain degree of shielding performance can be securedfor first component 41. Component 42 can be protected by resin film 22.

It should be noted that the following can be said for the firstembodiment. As shown in FIGS. 1 to 3 , module 101 includes component 43as a third component mounted on first surface 1 a, and second conductorfilm 5 b. Resin film 21 covers the third component along a shape of thethird component, and also covers a part of first surface 1 a. Secondconductor film 5 b covers at least a part of resin film 21 along theshape of the third component, and covers at least a part of a portion inwhich resin film 21 covers the part of first surface 1 a. Firstconductor film 5 a and second conductor film 5 b are spaced from eachother. With such a structure in which, for a plurality of components topay attention to, resin film 21 is integral, whereas the conductor filmis divided for each component, it is possible to avoid occurrence ofpropagation of noise between different components, which is preferable.

The same also applies to module 104 in the fifth embodiment shown inFIGS. 22 to 24 . The same also applies to module 105 in the sixthembodiment shown in FIGS. 25 to 27 . In module 105, first conductor film5 c and second conductor film 5 d are each further divided into theplurality of linear portions 5 r, and thereby have a stripe shape. Alsoin such a configuration, with a structure in which the conductor film isdivided for each component as shown in FIG. 25 , it is possible to avoidoccurrence of propagation of noise between different components, whichis preferable. A structure in which the conductor film is divided foreach component, and each divided conductor film has a stripe shape ispreferable.

The type, the shape, the size, the number, the arrangement, and the likeof the components shown in each embodiment described above are merely byway of example, and are not limited to those shown.

It should be noted that, of the embodiments described above, a pluralityof embodiments may be adopted in an appropriate combination.

It should be noted that the embodiments disclosed herein areillustrative and non-restrictive in every respect. The scope of thepresent disclosure is defined by the scope of the claims, and isintended to include any modifications within the scope and meaningequivalent to the scope of the claims.

1: substrate; 1 a: first surface; 1 b: second surface; 2: insulatinglayer; 3, 3 i: conductor structure; 5, 5 a, 5 c: first conductor film; 5b, 5 d: second conductor film; 5 r: linear portion; 6 a: first sealingresin; 6 b: second sealing resin; 8: shield film; 11, 17: externalelectrode; 13: conductor via; 14: pad electrode; 15, 15 e: groundelectrode; 18: solder; 18 e: solder paste; 21, 22: resin film; 25:opening (in the resin film); 26: head; 27: wire; 31: first end portion;32: second end portion; 33: intermediate portion; 41: first component;42, 43, 44, 46 a, 46 b, 46 c, 46 d, 47 a, 47 b, 47 c, 48, 49: component;50: connector; 51: ground conductor pattern; 52: patch antenna; 101,102, 103, 104, 105, 106, 107: module.

1. A module comprising: a substrate having a first surface; a firstcomponent mounted on the first surface; a resin film covering the firstcomponent along a shape of the first component, and also covering a partof the first surface; a first conductor film covering at least a part ofthe resin film along the shape of the first component, and also coveringat least a part of a portion in which the resin film covers the part ofthe first surface; and a conductor structure disposed to extend over apart of the resin film at a location where the first conductor filmcovers the first surface with the resin film being interposedtherebetween, wherein the conductor structure includes a first endportion, a second end portion, and an intermediate portion connectingthe first end portion and the second end portion, the first end portionis connected to the first surface, the second end portion is alsoconnected to the first surface, and the intermediate portion is incontact with the first conductor film.
 2. The module according to claim1, wherein the intermediate portion is disposed to extend over the firstconductor film.
 3. The module according to claim 2, wherein the firstconductor film includes a plurality of linear portions disposed to beparallel to each other with being spaced from each other, and theconductor structure is disposed to extend over at least one of thelinear portions in a width direction.
 4. The module according to claim1, wherein the first conductor film covers the intermediate portion. 5.The module according to claim 1, wherein the conductor structure is awire.
 6. The module according to claim 1, wherein the conductorstructure is a metal pin.
 7. The module according to claim 1, whereinthe module further comprises a first sealing resin disposed to cover thefirst surface, the first conductor film, and the resin film, and ashield film disposed to cover an upper surface and side surfaces of thefirst sealing resin.
 8. The module according to claim 1, wherein thesubstrate has a second surface as a surface opposite to the firstsurface, and the module further comprises a second component mounted onthe second surface.
 9. The module according to claim 8, wherein themodule further comprises a second sealing resin disposed to cover thesecond surface and the second component.
 10. The module according toclaim 1, further comprising an antenna.
 11. The module according toclaim 10, wherein the substrate has a second surface as a surfaceopposite to the first surface, and the antenna is disposed inside thesubstrate along the second surface.
 12. The module according to claim10, further comprising: a third component mounted on the first surface;and a second conductor film, wherein the resin film covers the thirdcomponent along a shape of the third component, and also covers a partof the first surface, the second conductor film covers at least a partof the resin film along the shape of the third component, and covers atleast a part of a portion in which the resin film covers the part of thefirst surface, and the first conductor film and the second conductorfilm are spaced from each other.
 13. The module according to claim 2,wherein the conductor structure is a wire.
 14. The module according toclaim 3, wherein the conductor structure is a wire.
 15. The moduleaccording to claim 4, wherein the conductor structure is a wire.
 16. Themodule according to claim 2, wherein the conductor structure is a metalpin.
 17. The module according to claim 3, wherein the conductorstructure is a metal pin.
 18. The module according to claim 4, whereinthe conductor structure is a metal pin.
 19. The module according toclaim 2, wherein the module further comprises a first sealing resindisposed to cover the first surface, the first conductor film, and theresin film, and a shield film disposed to cover an upper surface andside surfaces of the first sealing resin.
 20. The module according toclaim 3, wherein the module further comprises a first sealing resindisposed to cover the first surface, the first conductor film, and theresin film, and a shield film disposed to cover an upper surface andside surfaces of the first sealing resin.